Compal ACY25 series Spezifikationen

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Chapter 1: SYSTEM DESCRIPTION
SCOPE
This document describes the functional specifications for the Compal NoteBook personal
computer ACY25 series. The system is hardware and software compatible with the IBM
PC/AT personal computer.
SYSTEM
Intel Mobile P4 1.4G/1.5G/1.6G/1.7G/1.8G/1.9G/2.0GHz (μFCPGA CPU)
SIS650(SIS315 VGA embedded)
SB SIS961 for system controller, PCI controller, LPC, AC_link interface, IDE controller &
USB interface.
SMSC LPC47N227 for FDC, one Serial ports and one Parallel port
NS87591 for Keyboard Controller, Keyboard Scanner and Battery management Unit
ENE CB1420 for Card Bus PCMCIA controller.
Realtech ALC202A for AC97 codec
Realtech 8100BL for On Board LAN controller
Memory
Two 200-pin +2.5V DDR SO-DIMM connector, supporting PC1600/PC2100 DDR SDRM
memory card. Maximum upgradable to 1GMB by two 512MB DDR SO-DIMM modules.
128MB, 256MB, 512MB DDR SDRM RAM module.
512KB L2 Cache on CPU
BIOS
512KB Flash ROM for system and Keyboard BIOS (Bootblock)
a) Suspend to Disk
b) Password protection for System and HDD
c) PC99 and windows WinXP/W2K ready with PnP
d) ACPI compliant BIOS
e) Support windowXP
f) Various hot key for system control
Power
The charging time from empty to full capacity 3hrs typical (system off), 6.0hrs typical
(system on) at room temperature. based on system loading.
More than 300 charging / discharging cycles.
2.5hr battery mark operation time with PMU disable, APCI enabled and backlight adjusted
to 3/7 Maximum brightness.
8-cell Li-Ion of 18650 size battery pack with 57.7wh capacity
Chapter 1-1
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1 2 3 4 5 6 ... 174 175

Inhaltsverzeichnis

Seite 1 - Chapter 1-1

Chapter 1: SYSTEM DESCRIPTION SCOPE This document describes the functional specifications for the Compal NoteBook personal computer ACY25 series. The

Seite 2 - Chapter 1-2

Chapter 2-1 Chapter 2: Software Specification For System BIOS System Component Summary Platform CY25 Processor Intel® Mobile P4 uFCBGA/uFCPGA FSB 400

Seite 3 - Security

Expansion Memory 1. Remove one M2.5×5 screw securing the expansion memory compartment cover. Lift off the cover. Figure 5-22: Removing one screw secu

Seite 4 - Mother Board

2. Gently press out the latches securing the expansion memory. One end of the memory will pop up. 3. Grasp the expansion memory and pull it out. Fi

Seite 5 - Keyboard Controller

4. A spare expansion memory slot is located beneath the keyboard. To access this remove the keyboard following the instructions in section 4.5. Remov

Seite 6 - Audio Port

CD-RW/DVD-ROM or CD-ROM/Combo Drive 1. Remove one M2.5×5 screw securing the expansion memory compartment cover (see section 4.7). Lift off the cover.

Seite 7 - Display Device

3. Push on the tab to push out the drive. Grasp the front of the drive to pull it fully out. Figure 5-26: Removing the CD-RW/DVD-ROM or CD-ROM/Combo

Seite 8 - Environment Specification

FDD 1. Remove one M2.5×5 screw securing the expansion memory compartment cover (see section 4.7). Lift off the cover. 2. Detach the FDD cable. 3. Rem

Seite 9 - Storage or Shipment

5. Push the FDD out until you can grasp the front. Then pull the entire unit out. 6. Detach the FDD brace. For the Panasonic FDD unit (pictured) rem

Seite 10 - System Component Summary

HDD 1. Remove two M2.5×9 screws securing the HDD unit. Figure 5-30: Removing two screws securing the HDD unit 2. Lift out the HDD unit. 3. Remove f

Seite 11 - System Controls

Fan 1. Remove one M2.5×5 screw securing the CPU compartment cover. Figure 5-32: Removing the CPU compartment cover 2. Remove two M2.5×7 screws securi

Seite 12 - Core BIOS Features

CPU 1. Remove one M2.5×5 screw securing the CPU compartment cover (see section 4.11). 2. Remove four screws securing the thermal unit Figure 5-34:

Seite 13 - Chapter 2-4

Chapter 2-2 Status - Power status LEDs (Green/Amber) - Caps/Num/Scroll lock LEDs - HDD activity LEDs (Green)- Battery status/charging LED Controls

Seite 14 - Security Features

4. Turn the cam on the CPU socket with a flat-blade screwdriver so that the notch on the cam is aligned with the “open” side of the CPU socket to unl

Seite 15 - Thermal management

Top Cover 1. Remove the following screws securing the top cover: Ö Two M2.5×12 screws Ö Two M2.5×5 screws Ö Two M2.5×3 screw Figure 5-36: Removing f

Seite 16 - Power Management

2. Turn the computer over and remove the following screws securing the top cover: Ö Eight M2.5×9 screws Ö Two M2.5×18 screws Ö Two M2.5×7 screws Ö Tw

Seite 17 - • ACPI mode

Touch Pad 1. Remove six M2.5×4 screws securing the mouse cover board. 2. Lift off the mouse cover board. 3. Detach the speaker cables from the aud

Seite 18 - Miscellaneous Features

4. Detach the Touch pad board FFC cable. 5. Remove two M2.5×4 screws securing the audio board. 6. Gently lift out and turn over the audio board. 7.

Seite 19 - Chapter 2-10

Speakers 1. Remove one M2.5×4 screw securing each of the speakers. 2. Detach both speaker cables from the audio board (you will already have detached

Seite 20 - Configuration Requirements

Microphone jack 1. Remove two M2.5×4 screws securing the microphone jack. 2. Peel off the tape securing the microphone jack FFC. 3. Remove the micro

Seite 21 - Chapter 2-12

System Board 1. Remove three M2.5×5 screws securing the system board 2. Remove six helix screw nuts securing the rear ports. 3. Remove the system b

Seite 22 - Diskless Boot

Chapter 6: Testing and Troubleshooting The purpose of this chapter is to provide a systematic method of isolating problems you may have with the ACY25

Seite 23 - System Setup

STARTConnect the AC adapter to the DC-IN socketIs the DC-IN LED on?Is Windows being loaded?Is the Power On LED on?Is the logo message display?If the p

Seite 24 - Chapter 2-15

Chapter 2-3 Buttons Power Button Under ACPI, the power button action is under the control of the operation system. • The following is a table of the

Seite 25 - System Devices

EndInsert the diagnostics disk into FDD.Then run the diagnostics test program.Is an error detected by any of thediagnostics tests?System is normalAIs

Seite 26 - Chapter 2-17

If the diagnostics program cannot detect an error, the problem may be intermittent. The test program should be executed several times to isolate th

Seite 27 - Chapter 2-18

Power Supply Troubleshooting STARTAre the DC-IN andBattery LEDs lit?Can you turn thecomputer on?Are the internal powerconnections secure?ENDCheck Powe

Seite 28 - Chapter 2-19

The power supply controls many functions and components. To determine if the power supply is functioning properly, start with Procedure 1 and continu

Seite 29 - Informations Menu

If the DC-IN LED or Battery LED are not lit, go to Procedure 2 Procedure 2 Adaptor / battery replacement A faulty adaptor may not supply power or may

Seite 30 - Exit Menu

1. Reinstall the battery pack. 2. Attach the AC adaptor and turn on the power. If you cannot turn on the power, go to Procedure 5. 3. Run the Di

Seite 31 - OS Compatibility

Display Troubleshooting Perform external display check(Procedure 1)STARTDoes the externaldisplay function ok?Perform diagnostic check(Procedure 2)NoW

Seite 32 - Types of KB-BIOS provided

This section describes how to determine if the computer’s display is functioning properly. The process is outlined in Figure 6-3. Start with Procedur

Seite 33 - Chapter 2-24

FDD Troubleshooting Perform FDD headcleaning check(Procedure 1)STARTWas a FDDproblem detected?Perform connector and replacementcheck(Procedure 3)Rep

Seite 34 - Chapter 2-25

This section describes how to determine if the FDD is functioning properly. Perform the steps below starting with Procedure 1 and continuing as requi

Seite 35 - Chapter 2-26

Chapter 2-4 Multi Boot The notebook can support Multi Boot for selecting the boot sequence of hard disk, floppy, CD ROM, Network Boot in Setup. It id

Seite 36 - Chapter 2-27

Keyboard Troubleshooting Perform external keyboard check(Procedure 1)STARTDoes the externalkeyboard function ok?Perform diagnostic check(Procedure 2)

Seite 37 - Chapter 2-28

To determine if the computer’s keyboard is functioning properly, perform the following procedures. Figure 6-5 outlines the process. Start with Proced

Seite 38 - Chapter 2-29

External USB Devices Troubleshooting Replace system board(Procedure 2)ENDOriginal USBdevice is faultyPerform external device andconnection check(Proc

Seite 39 - Hot keys for system control

To determine if the computer’s external USB devices are functioning properly, perform the following procedures. Figure 6-6 outlines the process. Star

Seite 40 - Audio volume output control

TV-Out Failure Troubleshooting Perform TV connection check(Procedure 1)STARTDoes replacement TV cablefunction properly?Perform TV set check(Procedure

Seite 41 - Battery status

To determine if the computer’s TV-out port is functioning properly, perform the following procedures. Figure 6-7 outlines the process. Start with Pro

Seite 42 - Battery type

Printer Port Troubleshooting Perform external keyboard check(Procedure 1)STARTDoes the externalkeyboard function ok?Perform diagnostic check(Procedur

Seite 43 - APM Mode ACPI mode

To determine if the computer’s printer (parallel) port is functioning properly, perform the following procedures. Figure 6-8 outlines the process. St

Seite 44 - Extra keyboard emulation

Touch Pad Troubleshooting STARTENDTouch Pad connectioncheck (Procedure 1)Touch Pad replacementcheck (Procedure 2)Replace system board Figure 6-9 T

Seite 45 - Devices PnP configuration

To determine if the computer’s built-in Touch Pad is functioning properly, perform the following procedures. Figure 6-9 outlines the process. Start w

Seite 46 - EC name space Configuration

Chapter 2-5 Security Features Security features to be supported are passwords, electronic serial number, PC identification string. The Electronic Ser

Seite 47 - Chapter 2-38

Speaker Troubleshooting STARTDo all sources havesame problem?ENDPerform earphone test(Procedure 2)Do earphonesfunction correctly?Perform connection c

Seite 48 - Chapter 2-39

To determine if the computer’s built-in speakers are functioning properly, perform the following procedures. Figure 6-10 outlines the process. First

Seite 49 - Chapter 2-40

DVD-ROM and CD-RW/DVD-ROM Troubleshooting STARTAudio CD functions ok?ENDPerform software check(Procedure 3)Perform diagnostic test(Procedure 4)Perfor

Seite 50 - Chapter 2-41

This section describes how to determine if the computer’s internal DVD-ROM drive or CD-RW/DVD-ROM drive is functioning properly. Figure 6-11 outlines

Seite 51 - battery pack RAM definition

Modem Troubleshooting STARTComputer unable todetect telephone signal?ENDPerform connection check(Procedure 2)Perform replacementcheck(Procedure 3)Per

Seite 52

This section describes how to determine if the computer's modem is functioning properly. Figure 6-12 outlines the process. Perform the steps bel

Seite 53 - Chapter 3: Hardware

PCMCIA Troubleshooting STARTDo errors occur duringSYCARD test?Perform PCMCIA socketreplacement check(Procedure 2)Replace system boardENDPCMCIA unit i

Seite 54 - MOTHER BOARD

This section describes how to determine if the PCMCIA card player is functioning properly. The process is summarized in Figure 6-13. Perform the step

Seite 55 - PCN2 BATT-B.PRT

IEEE 1394 Troubleshooting STA RTPerform IEEE 1394 device check(P ro ce d u re 1)Is IE E E 1394 transm ission ok?ENDYesPerform diagnostic check(P r

Seite 56 - JP10 CDROM.PRT

To determine if the computer’s IEEE 1394 system is functioning properly, perform the following procedures. Figure 2-14 outlines the process. Start wi

Seite 57 - JP12 PCMCIA-CONN. 84P.PRT

Chapter 2-6 • The numbers 0 to 9. • The letters A to Z (not case sensitive). The password is stored as scan codes. Electronic Serial Number The el

Seite 58 - Chapter 3-6

Wireless LAN Troubleshooting STARTPerform diagnostic test(Procedure 1)Was an wireless LAN problem delected?YesPerform connector and replacement chec

Seite 59 - JP5 DDR-200P.PRT

The wireless LAN antenna wire, wireless LAN unit or system board may each be the source of a wireless LAN fault. Any of these components may be damag

Seite 60 - Chapter 3-8

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 61 - Chapter 3-9

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 62 - JP1 CPU FAN CONN

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 63 - JP4 DDR 200P SO-DIMM

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 64 - Chapter 3-12

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 65 - JP29 Audio M/B

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 66 - JP16 MINI-PCI CONN

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 67 - Chapter 3-15

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 68 - JP11 1394 CONN

Chapter 2-7 reduced in an effort to reduce heat generation. The second type is active cooling where a fan is turned on to cool the system. In non-AC

Seite 69 - Chapter 4: AC-DC CONVERTER

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 70

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 72 - Fixed output voltage/Current

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 73 - Chapter 4-5

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 74 - Chapter 4-6

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 76 - Chapter 4-8

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 77 - Connector description

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 79 - General

Chapter 2-8 Device Power Management The device specific power management supported by this notebook includes the CPU and the hard disk. CPU power m

Seite 80 - Chapter 5-2

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 82 - Before You Begin

Material List by Single-Item/Single-Level ---------------------------------------------------------------------

Seite 84 - Tools and Equipment

Table of contents: 1. System Description ------------------------------------------------------------------------ 1-1 Scope --------------------------

Seite 85 - Battery

Chapter 1 2 Remove CPU --------------------------------------------------------------------------------- 5-31Remove Top Cover ------------------------

Seite 86 - PC Card

Chapter 2-9 Critical low battery - - - - Field ‘Process Required’ identifies that further process for the occurred events must be processed durin

Seite 87 - Display Assembly

Chapter 2-10 EEPROM There is one EEPROM which is used to store many important system and user data in the notebook The size of the EEPROM is 2K byte

Seite 88 - Chapter 5-10

One 2.5" (9.5mm) up to 40GB Hard Disk • Bus Master IDE • Removable • Support Ultra 100 synchronous DMA(ATA-100) LAN on board 3COM Realtech 810

Seite 89 - Chapter 5-11

Chapter 2-11 customer may choose to manually install it. The Synaptics TouchPad driver should only be installed after first selecting Touch pad only

Seite 90 - Chapter 5-12

Chapter 2-12 15 Secondary IDE controller (CD ROM) DMA Hardware 00 PnP Audio System CODEC 01 Free 02 Standard Floppy Disk Controller 03 ECP Pri

Seite 91 - Chapter 5-13

Chapter 2-13 25 System Power Control NO 26 Voltage Probe NO 27 Cooling Device NO 28 Temperature Probe NO 29 Electrical Curretn Probe NO 30 Ou

Seite 92 - Chapter 5-14

Chapter 2-14 System Setup Invoking setup The setup function can only be invoked by pressing F2 when ″ Press <F2> to enter Setup″ message is pro

Seite 93 - Chapter 5-15

Chapter 2-15 The Floppy Drive status is auto detected by system. 1.44MB, 3 1/2 “ If there exists floppy drive. Not installed If th

Seite 94 - Chapter 5-16

Chapter 2-16 System Devices PhoenixBIOS Setup Utility Main System Devices Security Boot Info. Exit Item specif

Seite 95 - Keyboard / button board

Chapter 2-17 Normal/Bi-directional/ECP/EPP Base I/O address 378h/278h/3BCh Interrupt IRQ 5/IRQ 7 ECP DMA channel: This field is hidden if Mode is n

Seite 96 - Chapter 5-18

Chapter 2-18 Set User Password / Set Administrator Password Enter This field always shows the message. While these fields are highlighted and press ′

Seite 97 - Wireless LAN / Modem Unit

Chapter 2-19 Characters 0-9, A-Z (not case sensitive) Password Required to Defines whether a password is required or not while the events defined in

Seite 98 - Chapter 5-20

Chapter 2-20 Informations Menu PhoenixBIOS Setup Utility Main System Devices Security Boot Info. Exit Item sp

Seite 99 - Chapter 5-21

Excellent Power Management Function • Standby mode or Hibernation mode, by time out or by hot key • Speedstep option • HDD Local Stand-By mode by t

Seite 100 - Expansion Memory

Chapter 2-21 Exit Menu PhoenixBIOS Setup Utility Main System Devices Security Boot Info. Exit Item specific H

Seite 101 - Chapter 5-23

Chapter 2-22 Discarding Changes and Exit Allows the user to not save changes before exiting Setup. The following message is shown when user presses

Seite 102 - Chapter 5-24

Chapter 2-23 Software Specification for KB-BIOS General purpose This document define the EC specification with standard interface and also define

Seite 103 - Chapter 5-25

Chapter 2-24 CMD DATA Description return 41h EC state notification A0h Return core code version number One byte A1h Return platform id

Seite 104 - Chapter 5-26

Chapter 2-25 CMD DATA Description return 4Bh Write the data to device through SMBus interface 1 00h-FFh Slave address of device 2 00h

Seite 105 - Chapter 5-27

Chapter 2-26 Command set 50h-5Fh for OEM defined through Port60/64 and Port62/66 Command Set (from system's point of view) via 60/64 and 62/6

Seite 106 - Chapter 5-28

Chapter 2-27 CMD DATA Description return Bluetooth wake up event A9h Bluetooth switch event Aah Scr expand event Abh 56h Cpu fas

Seite 107 - 2. Lift out the HDD unit

Chapter 2-28 CMD DATA Description return Mouse hot plug event Cfh 56h CRT plug in/out event D0h Sleep button event D1h RTC date/t

Seite 108 - 4. Remove the fan

Chapter 2-29 CMD DATA Description return Aah Both enable external PS2 and internal touch pad None Ach Auto enable/disable external PS2 and int

Seite 109 - Chapter 5-31

Chapter 2-30 CMD DATA Description return F7h Restart system and Clear header of Boot code None F8h Shut down system and Clear header of Boot

Seite 110 - Chapter 5-32

Electrical specifications Mother Board Microprocessor • Intel μFCPGA • Design for Mobile, Northwood, PENTIUM 4 • Level 2 Cache controller

Seite 111 - Top Cover

Chapter 2-31 Pressing this hot key can enable/disable the embedded cursor keypad. Numeric lock state is logically disable. Fn + F11 Num keypad on/of

Seite 112 - Chapter 5-34

Chapter 2-32 Definitions of System state LED • There is one dual-color LED indicator both of Green and Amber color • Green color support for System

Seite 113 - Touch Pad

Chapter 2-33 Battery discharge/charging control Charging Dischargung Action Charging :0℃<T<50℃ Stop charging:T>60℃ Stop charging & Red

Seite 114 - Chapter 5-36

Chapter 2-34 Power states • Sleep mode LCD panel back-light off • Save to RAM keyboard(int./ext.) scanning off • Save to DISK no actions except tur

Seite 115 - Speakers

Chapter 2-35 55℃50℃ ,and if temperature over 92℃85℃ five times,EC will auto turn off system to protect CPU.For detail data please reference follows

Seite 116 - Microphone jack

Chapter 2-36 “ 7“,” 8“,” 9“,” 0“,” U”,” I”,” O”,” P”,” J”,” K”,” L”,” ;”,” M”,” .”,” /”. Other Fn key • Scroll lock :press Fn + F12 • Numeric keypa

Seite 117 - System Board

Chapter 2-37 Internal keyboard change Configuration US/UK/JP country option • The KBC supports three country selection by KBD_SEL application. • Y

Seite 118 - Troubleshooting Flowchart

Chapter 2-38 Offset Description Bit6 – CURRENT_OR(Set if CHG_CURRENT out of range) Bit7 – VOLTAGE_OR(Set if CHG_VOLT out of range) Bit8 – THERMIST

Seite 119 - Chapter 6-2

Chapter 2-39 Word registers to Emulate smart selector RAM definition Offset Description 9Ah SEL_STATE0 Bit0 – PRESENT_A(Set if 1st battery present)

Seite 120 - Chapter 6-3

Chapter 2-40 Offset Description Bit1 – UDRF, Undock request(0=inactive, 1=undock & flash LED) Bit2 – UDRS, Undock request(0=inactive, 1=undock

Seite 121

Super I/O Controller • SMSC LPC47N227 • Outstanding Features • LPC bus interface, based on Intel’s LPC Interface Specification Revision 1.0

Seite 122 - Power Supply Troubleshooting

Chapter 2-41 Offset Description 0 1 : Fan on speed 1 1 0 : Fan on speed 2 1 1 : Fan on speed 3 Bit3 – INITOK ( 0:Control by OS

Seite 123

Chapter 2-42 Control method for 1st battery pack RAM definition Offset Description C0h Bit4-6 – Manufacturer Bit 6 5 4 0 0 1 :

Seite 124

Chapter 2-43 Offset Description E2h-E3h Remaining Capacity E4h-E5h Serial Number E6h-E7h Present Voltage E8h-E9h Design Voltage EAh-EBh Design Capac

Seite 125

Chapter 3: Hardware Major Sub-assembly Specification System interconnection (For BY25) Chapter 3-1

Seite 126 - Display Troubleshooting

MOTHER BOARD JP28 KBD/PS2_6.PRT PIN NO SIGNAL PIN NO SIGNAL 1. KBD_DATA 2. PS2_DATA 3. GND 4. VCC 5. KBD_CLK 6. PS2_CLK JP24,JP26,JP31 US

Seite 127

5. FD3 6. FD4 7. FD5 8. FD6 9. FD7 10. LPTACK# 11. LPTBUSY 12. LPTPE 13. LPTSLCT 14. LPTAFD# 15. LPTERR# 16. LPT_INIT# 17. SLCTIN# 18.

Seite 128 - FDD Troubleshooting

3. GND 4. BATT_TEMP 5. EEPROMVCC 6. SMB_EC_CK1 7. SMB_EC_DA1 8 GND JP19 FDD.PRT PIN NO SIGNAL PIN NO SIGNAL 1. HDSEL# 2 GND 3 RDATA# 4 GND

Seite 129

29. SD_IRQ15 30. NC 31. SD_SBA1 32. CBLIDB 33. SD_SBA0 34. SD_SBA2 35. SD_CS1# 36. SD_SCS3# 37. CDLED# 38. +5V_IDE 39. +5V_IDE 40. +5V_ID

Seite 130 - Keyboard Troubleshooting

A51 S1_A6 A52 S1_VS2 A53 S1_A5 A54 S1_RST A55 S1_A4 A56 S1_WAIT# A57 GND A58 S1_A3 A59 S1_INPACK# A60 S1_A2 A61 S1_REG# A62 S1_A1 A63 S1_

Seite 131 - Procedure 2 Diagnostic test

B45. S2_A23 B46. S2_A12 B47. S2_A24 B48. S2_A7 B49. GND B50. S1_A25 B51 S1_A6 B52 S1_VS2 B53 S1_A5 B54 S1_RST B55 S1_A4 B56 S1_WAIT# B57

Seite 132 - Chapter

ACPI CarBus Controller ENE CB1420 • ACPI-PCI Bus Power Management Interface specification Rev 1.1 Compliant • Supports OnNow LAN wakeup, On

Seite 133

39. GND 40. GND 41. MD16 42. MD20 43. MD21 44. MD17 45. +2.5V 46. +2.5V 47. RDQS2 48. GND 49. MD18 50. MD22 51 GND 52 GND 53 MD19 54

Seite 134

115 MAA10 116 MAA12 117 MAA11 118 SRAS# 119 SWE# 120 SCAS# 121 RCS0# 122 RCS1# 123 NC 124 NC 125 GND 126 GND 127 MD32 128 MD36 129 MD37

Seite 135 - Procedure 2 TV set check

191 +2.5V 192 +2.5V 193 SMBDAT 194 GND 195 SMBCK 196 GND 197 +3VS 198 GND 199 NC 200 NC JP18 Int. KB Interface CONN PIN NO SIGNAL PIN NO

Seite 136 - Printer Port Troubleshooting

JP14 RJ45-11 CONN. PIN NO SIGNAL PIN NO SIGNAL 1. R 2. R 3. RX- 4. R 5. R 6. RX+ 7 TX- 8. TX+ 9. NC 10. MOD TIP 11. MOD RING 12. NC 13. GND 14. GN

Seite 137 - Procedure 1 Diagnostic test

55 MD24 56 MD28 57 +2.5V 58 +2.5V 59 MD25 60 MD29 61 RDQS3 62 GND 63 GND 64 GND 65 MD30 66 MD26 67 MD31 68 MD27 69 +2.5V 70 +2.5V 71 GND 72 GND 73 GN

Seite 138 - Touch Pad Troubleshooting

137 GND 138 GND 139 MD35 140 MD39 141 MD40 142 MD44 143 +2.5V 144 +2.5V 145 MD41 146 MD45 147 RDQS5 148 GND 149 GND 150 GND 151 MD42 152 MD43 153 MD4

Seite 139

1 CLK 14M SIO 2 GND 3 AC97 BCLK 4 HPLUG 5 AC97 RST# 6AC97 SYNC 7 AC97 SDOUT 8AC97 SDIN0 9 MD MIC 10 MONO IN 11 MOD AUDIO MONR 12 +3VS 13 CD AGND 14

Seite 140 - Speaker Troubleshooting

47. AD23 48. MINI IDSEL 49. GND 50. GND 51 AD21 52 AD22 53 AD19 54 AD20 55 GND 56 PAR 57 AD17 58 AD18 59 CBE#2 60 AD16 61 IRDY# 62 GND 63 +3VS 64 FRA

Seite 141 - Procedure 2 Earphone test

JP7 TV-OUT CONN PIN No SIGNAL PIN No SIGNAL 1 GND 2 LUMA 3 GND 4 CRMA 5 GND 67 COMPS JP8 PANEL CONN PIN No SIGNAL PIN No SIGNAL 1. LCDVDD 2.

Seite 142

Chapter 4: AC-DC CONVERTER ACY25 series Power System block diagram Chapter 4-1

Seite 143 - Procedure 4 Diagnostic test

Display Device • COLOR TFT/XGA LCD (CPT CLAA141XF01) Dimensions : 298.5 (W) X 227.5 (H) X 5.5 (D) mm (max) Active area : 285.7(W) X 214.3(H) mm, 14.

Seite 144 - Modem Troubleshooting

Description This specification defines the performance and characteristic ASTEC SA80-3105-2278 AC adapter power supply. It supplies a constant voltag

Seite 145

DC-DC CONVERTER Description The DC-DC converter is designed to supply the power for ACY25 series notebook computer of Compal. It supply +5VALWP, +3VA

Seite 146 - PCMCIA Troubleshooting

DC/DC OUTPUT Fixed output voltage/Current Item +5VALWP +1.25VP +1.2VP nominal voltage +5V +1.25V +1.2V min. load 0A 0A 0A max. load 4A 2A 0.

Seite 147

Charger Controlled by NS87591 microprocessor from motherboard Temperature sense capability for the battery (charge active between 0℃~ 40℃) fast char

Seite 148 - IEEE 1394 Troubleshooting

DC/DC Interface DC/DC Signals I/OVoltage Level Description EC_ON# I 0~floating Active Low, NS87591 use this pin to control the system power on/of

Seite 149

ACY25 14.1” & 15” INVERTER SPECIFICATION General Description There are two control signals that come from system to control lamp brightness. One

Seite 150 - Wireless LAN Troubleshooting

142 150 158 Hz PWM signal frequency 3.0 3.3 3.6 V PWM signal amplitude 11 PWM signal *note 4 INV_PWM 30 -- 100 % PeriodTonDuty = 12 lamp cu

Seite 151

Electrical specification No Symbol Min. Typ. Max. Unit Comment Voper. -- 700 -- Vrms Lamp operating voltage IL5.7 6.0 6.3 mArms DAC_BRI

Seite 152

Output Connector: CN2: JST_SM02B_BHSS-1 Pin No. Symbol Description 1 HV Connected to high voltage of LCD lamp 2 LV Connected to low voltage of

Seite 153

Chapter 5: Disassembly General This chapter provides detailed directions for disassembling the computer. You will require a medium size screwdriver,

Seite 154

Keyboard • 86 /90 keys with 101/102 key emulation • 3.0±0.15mm full stroke keys, operating force 60±10g • Phantom key auto detect • Overlay numeri

Seite 155

The example below shows which modules need to be removed before the audio board can be removed and repaired or replaced. The audio board is overlapped

Seite 156

Safety Precautions Before you begin disassembly, read the following safety precautions and observe them carefully as you work. DANGER: 1. Always use

Seite 157

Before You Begin Look over the procedures in this section before you begin disassembling the computer. Familiarize yourself with the disassembly and r

Seite 158

Disassembly Procedures The computer has two basic types of cable connectors:  Pressure Plate Connectors  Standard Pin Connectors To disconnect a P

Seite 159

Tools and Equipment The use of Electrostatic Discharge (ESD) equipment is very important for your safety and the safety of those around you. Proper us

Seite 160

Battery 1. Place the computer upside down with the front facing toward you. 2. Press the battery release button down and slide the battery latch to

Seite 161

PC Card 1. Push the eject button for the card you want to release. The button will pop out when you release it. Figure 5-2: Ejecting a PC card (1/2)

Seite 162

Display Assembly The instructions and figures below are for the 15” display. Differences with the 14” display are indicated where necessary. Removing

Seite 163

2. Open the display fully so that the display and computer are flat on the table. 3. Insert the end of a small screwdriver between the strip cover a

Seite 164

4. Lever the LCD display wire set connector off the system board connector. Do not pull on the wire itself as this may cause damage. Instead, pull on

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Storage or Shipment Temperature -20°C to +50°C Relative Humidity 10% to 90% without condensation Altitude sea level to 40,000ft Chapter 1-9

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6. Turn the computer over. Remove two M2.5×9 screws from the base and two M2.5×7 screws from the rear panel. Figure 5-7: Removing two screws securin

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Figure 5-9: Removing two screws securing the LCD bezel 2. Ease the bezel off the display, starting from one of the sides. The bezel is secured by la

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Figure 5-11: Removing eight screws securing the LCD module 4. Lift the LCD module out of the LCD cover. Chapter 5-14

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5. Release the LCD cable from its hook to the left of the FL inverter board. 6. Detach the HV cable from the right of the FL inverter board. Figur

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Figure 5-14: Removing the LCD cable 12. Remove six M2×2.5 screws securing the LCD bracket to the LCD module (the 14” LCD module is secured by four sc

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Keyboard / button board 1. Remove four M2.5×3 screws securing the keyboard. Figure 5-16: Removing four screws securing the keyboard Chapter 5-17

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2. Lift the keyboard up and place higher on the computer base unit so that the keyboard cable connector is exposed. 3. Detach the keyboard cable and

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Wireless LAN / Modem Unit 1. Remove two M2.5×3 screws securing the wireless LAN card compartment cover. Remove the cover. Figure 5-19: Removing the

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2. Disconnect the modem cable. 3. If you will subsequently remove the top cover, you should peel back the tape covering the Touch pad FFC and detach

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4. Push out the two latches securing the wireless LAN /modem card. One end of the card will pop up. 5. Grasp the wireless LAN /modem card and pull

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